Beskrivning
PCB/PCBA/MCPCB/LED PCB
| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
|
Min. board Thickness |
2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4mil) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4mil) | ||
| Min. hole size | 0.2mm(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6mil) | ||
| Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
| Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 08:01 | ||
| Hole wall copper thickness | 15-50en | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30en) | |
| at trace corner | ≥0.2mil(5en) | ||
| On base material | ≤+1.2mil | ||
| Finished thickness | |||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50en) | ||
| Min width of solder mask bridge | 4mil(100en) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. |
||
| Max Nickel thickness for Gold finger | 280u”(7en) | ||
| Max gold thickness for Gold finger | 30u”(0.75en) | ||
| Nickel thickness in Immersion Gold | 120u”/240u”(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u”/6u”(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
1. PCB layer: 1-12 layers
2. PCB Certificate: ISO UL REACH and RoHS
3. FR-4 Material
4. Best price with excellent after-service
5. Reputable manufacturer
Hello, are you still looking for some manufactory to test your PCB circuit design?
We offer 3-6 workdays delivery time for make protoypes.
1. We have 10 years experience in circuit board, Printed Circuit Board field to serve your needs.
2. Competitive circuit board, Printed Circuit Board price with high quality.
3. Excellent service and prompt delivery
4. Our circuit board, Printed Circuit Board get ISO and UL Certificates and meet RoHS REACH standard
5. You can contact us at any time, we are 24-hour service for you!
| NEJ | Punkt | Technical capabilities |
| 1 | Layers | 1-12 layers |
| 2 | Max. Board size | 2000×610mm |
| 3 | Min. board Thickness | 2-layer 0.25mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.15mm(4-5mil) |
| 5 | Max. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.15mm(4-5mil) |
| 7 | Min. hole size | 0.2mm(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
| 10 | Hole position deviation | ±0.05mm(2mil) |
| 11 | Outline tolerance | ±0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288°C10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min. blind/buried via | 0.2mm (8mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |