Gold Finger PCB Assembly Circuit Board Mass Production

Modelo NÃO.
rigid pcb board

Tecnologia de Processamento
Immersion Gold

Base Material
Fr4 Tg180

Insulation Materials
Organic Resin

Marca
OEM

Board Thickness
1.8milímetros

Cobre
2/2oz

Finish
Immersion Gold 3u

Mini Hole
0.4milímetros

Mini Width/Space
4/4mil

Pacote de transporte
Vácuo

Especificação
185 X 86mm

Marca comercial
NO

Origem
Feito na china

Código HS
8534009000

Capacidade de produção
4000m2/Mont

Descrição

Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customerssatisfaction.

Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer’s complaint:<1%

Automobile products:
Rate of the first passed products :100%
Rate of customer’s complaint::<0.5%


Fotos detalhadas

Product Parameters
Rigid PCB Production Capacity
SERIAL ITEM TECHNICAL DATA
1 Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI
2 Layers 232(layers)
3 Max Board Size 450x660mm 18x 26
4 Min Board Thickness 4(layers)0.40mm 16mil
6(layers)0.80mm 32mil
8(layers)1.00mm 40mil
10(layers)1.20mm 48mil
5 Copper Clad(Max.) 20 oz(outer)/4 oz(inner)
6 Min line Width/space 0.075mm 3mil
7 Drill Size Mechanical (min) 0.20mm 8mil
8 Drill Size Laser(min) 0.10mm 4mil
9 PTH Wall Thickness 0.020mm 0.8mil
10 PTH dia tolerance ±0.075mm ±3mil
11 NPTH hole dia tolerance ±0.05mm ±2mil
12 Hole Position Deviation ±0.05mm ±2mil
13 Outline Tolerance ±0.10mm ±4mil
14 S/M Pitch 0.08mm 3mil
15 Insulation Resistance 1E+12Ω(Normal)
16 Test Voltage 50~300V
17 Aspect ratio 8:01
18 Thermal Shock [email protected] C
19 Warp and Twist ≤0.7%
20 Current breakdown 10UMA
21 Electric Strength >1.3KV/mm
22 Peel Strength 1.4N/mm
23 Solder Mask Abrasion ≥6H
24 Flammability 94V-0
25 Impedance Control +/-10%(Differential)
26 Buried Via sim
27 Blind Via sim
28 HDI 2+N+2 4mil Via hole
29 Surface Finished ENIG, ImAg, ImSn, OSP, HASL free
30 Materials FR-4 , Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, black Fr4
Packaging & Shipping

Gold Finger PCB Assembly Circuit Board Mass Production

Perguntas frequentes

Gold Finger PCB Assembly Circuit Board Mass Production