Experienced China PCB Assembly and PCB Board Manufacturer

Model NO.
uc-16081504

Processing Technology
Immersional Gold

Base Material
Copper

Insulation Materials
Organic Resin

Brand
Ucreate PCB

Board Thickness
1.2~2.0mm

Surface Finihsing
Immersional Gold

Lead Time
6-8 Working Days

Certificate
ISO,UL,RoHS

PCB Testing
E-Testing; Flying Probe Testing

Mask Ink Color
White/Black/Green/Red/Yellow/Blue

Color
Green Blue Red

Number of Layers
Multilayer

Copper Thickness
2oz

Condition
Original Made

Transport Package
Vacuum Packing

Specification
IPC-Class 2

Trademark
Ucreate PCB

Origin
Shenzhen China

HS Code
85340090

Production Capacity
5000sq. M/Month

Description


 
                                        Ucreate LTD PCB’s aim
 
                   Customer Satisfaction is Always Our First Priority!

 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer’s satisfaction
 

1.Products Application

2. Market Distribution
 
Experienced China PCB Assembly and PCB Board Manufacturer
 
 
3.Technical Capabilities

Items Speci. Remark
Max panel size 32” x 20.5″(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  
Board thickness tolerance control ±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um)  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness
 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u”(7um)  
Max gold thickness for Gold finger 30u”(0.75um)  
Nickel thickness in Immersion Gold 120u”/240u”(3um/6um)  
Gold thickness in Immersion Gold 2u”/6u”(0.05um/0.15um)  
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist
 
0.75%  

 
4.Products Equipment
    
Experienced China PCB Assembly and PCB Board Manufacturer
Certificates:
Experienced China PCB Assembly and PCB Board Manufacturer
Experienced China PCB Assembly and PCB Board Manufacturer
Experienced China PCB Assembly and PCB Board Manufacturer
Experienced China PCB Assembly and PCB Board Manufacturer