2018 High Quality Red Soldermask Immersion Gold PCB

Model NO.
PCB-Multilayer 001

Insulation Materials
Epoxy Resin

Transport Package
Vacuum Packing

Specification
UL ISO TS16949 IPC2-3 Standard

Trademark
ZAPON

Origin
China

HS Code
85340090

Production Capacity
50000sqm/Month

Description

ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.

Manufacturing House:


2018 High Quality Red Soldermask Immersion Gold PCB
2018 High Quality Red Soldermask Immersion Gold PCB

Item Capabilities
Number of Layers From 4-layer to 22- Layer
Material FR-4, HighTg, Rogers
Halogen Free
PCB Thickness Min. thickness 0.4mm(16mil)
Max. thickness 3.2mm(128mil)
Surface Treatment Gold Plating
Immersion Gold(Silver)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder Mask Green, White, Black, Yellow, Red, Blue
Other printing Gold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness 1/ 2 oz (18 μ m) – 4 oz (140 μ m)
Min. Finished Hole Size 0.2mm(8mil)
Hole Size Tolerance (PTH) +/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH) +/-0.05mm (2 mil)
Min. Line Width and Spacing 0.1mm (4 mil)
Min. Solder Mask Clearance 0.05mm (2 mil)
Min. Annular Ring 0.076mm (3mil)
Profile and V-Cut CNC-Routing, Stamping and Beveling, V-CUT, CNC
Special Process Micro-section, Chamfer for Gold Finger
    File format   Gerber file  , CAM350, Protel, PowerPCB
    E-TEST Flying Prob  , E-test, Fixture
  Other Test   Impedance  , Slice up
  Warp & Twist   ≤ 0.7%