Beschrijving
PCB/PCBA/MCPCB/LED PCB
| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
|
Min. board Thickness |
2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4miljoen) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4miljoen) | ||
| Min. hole size | 0.2mm(8miljoen) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2miljoen) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2miljoen) | ||
| Hole position deviation | ±0.05mm(2miljoen) | ||
| Outline tolerance | ±0.10mm(4miljoen) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6miljoen) | ||
| Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
| Materialen | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 miljoen(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 miljoen(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 08:01 | ||
| Hole wall copper thickness | 15-50een | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2miljoen(10-30een) | |
| at trace corner | ≥0.2mil(5een) | ||
| On base material | ≤+1.2mil | ||
| Finished thickness | |||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50een) | ||
| Min width of solder mask bridge | 4miljoen(100een) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Onderdompeling zilver. |
||
| Max Nickel thickness for Gold finger | 280u”(7een) | ||
| Max gold thickness for Gold finger | 30u”(0.75een) | ||
| Nickel thickness in Immersion Gold | 120u”/240u”(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u”/6u”(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
1. PCB layer: 1-12 lagen
2. PCB Certificate: ISO UL REACH and RoHS
3. FR-4 Material
4. Best price with excellent after-service
5. Reputable manufacturer
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| NEE | Item | Technical capabilities |
| 1 | Lagen | 1-12 lagen |
| 2 | Max. Board size | 2000×610mm |
| 3 | Min. board Thickness | 2-layer 0.25mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.15mm(4-5miljoen) |
| 5 | Max. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.15mm(4-5miljoen) |
| 7 | Min. hole size | 0.2mm(8miljoen) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2miljoen) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2miljoen) |
| 10 | Hole position deviation | ±0.05mm(2miljoen) |
| 11 | Outline tolerance | ±0.10mm(4miljoen) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288°C10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min. blind/buried via | 0.2mm (8miljoen) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materialen | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |