説明
| Items | Speci. | |
| Max panel size | 32″ x 20.5″(800mm x 520mm) | |
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | |
| Min PAD (inner layer) | 5 mil(0.13mm) | |
| Min thickness(inner layer) | 4 mil(0.1mm) | |
| Inner copper thickness | 1~4 oz | |
| Outer copper thickness | 0.5~6 oz | |
| Finished board thickness | 0.4-3.2 mm | |
| Board thickness tolerance control | ±0.10 mm | ±0.10 mm |
| ±10% | ±10% | |
| ±10% | ±10% | |
| Inner layer treatment | brown oxidation | |
| Layer count Capability | 1-30 LAYER | |
| alignment between ML | ±2mil | |
| Min drilling | 0.15 mm | |
| Min finished hole | 0.1 mm | |
| Hole precision | ±2 mil(±50 um) | |
| tolerance for Slot | ±3 mil(±75 um) | |
| tolerance for PTH | ±3 mil(±75um) | |
| tolerance for NPTH | ±2mil(±50um) | |
| Max Aspect Ratio for PTH | 08:01 | |
| Hole wall copper thickness | 15-50um | |
| Alignment of outer layers | 4mil/4mil | |
| Min trace width/space for outer layer | 4mil/4mil | |
| Tolerance of Etching | +/-10% | |
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) |
| at trace corner | ≥0.2mil(5um) | |
| On base material | ≤+1.2mil | |
| Finished thickness | ||
| Hardness of solder mask | 6h | |
| Alignment of solder mask film | ±2mil(+/-50um) | |
| Min width of solder mask bridge | 4mil(100um) | |
| Max hole with solder plug | 0.5mm | |
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | |
| Max Nickel thickness for Gold finger | 280u”(7um) | |
| Max gold thickness for Gold finger | 30u”(0.75um) | |
| Nickel thickness in Immersion Gold | 120u”/240u”(3um/6um) | |
| Gold thickness in Immersion Gold | 2u”/6u”(0.05um/0.15um) | |
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | |
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | |
| bow and twist | 0.75% | |
Double sided pcb board with osp finish:
Place of Origin Guangdong, 中国 (本土)
Brand Name OKEY
Model Number okey pcb
Base Material FR-4
Copper Thickness 1 OZ
Board Thickness 1.2 mm
分. Hole Size 0.4mm
分. Line Width 0.2mm
分. Line Spacing 0.15mm
Surface Finishing HASL
Color red
Small order acceptable
Fire resistanceUL-94V0
Outline/contourmilling, V-cut, CNC Routing
100% productsE-test or flying probe test
特徴
Thin board capabilities
Increase routing density in complicated desig
Excellent mounting stability and reliability
Qualified material and surface treatment for Lead-free process
Applications
Smartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD Module
Benefits
Well experienced manufacturer with good yiel
Multiple plants increase production output in short time
| いいえ | アイテム | Technical capabilities |
| 1 | Layers | 1-20 layers |
| 2 | マックス. Board size | 2000×610mm |
| 3 | 分. board Thickness | 2-layer 0.15mm |
| 4-layer 0.4mm | ||
| 6-layer 0.6mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | 分. line Width/Space | 0.1mm(4mil) |
| 5 | マックス. Copper thickness | 10OZ |
| 6 | 分. S/M Pitch | 0.1mm(4mil) |
| 7 | 分. hole size | 0.2mm(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
| 10 | Hole position deviation | ±0.05mm(2mil) |
| 11 | Outline tolerance | ±0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6h |
| 16 | Thermal stress | 288°C 10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | 分. blind/buried via | 0.15mm (6mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
