2390 Tie Points Interlocking Solderless Breadboard

モデル番号.
ZY-206

Housing Material
ABS

Dielectric
SIC

輸送パッケージ
Blister Card

商標
OEM

中国

HSコード
8534009000

生産能力
15000 Piece/Pieces/Day

説明


2390 Tie Points Interlocking Solderless Breadboard
2390 Points Solderless Breadboard
* 3 Terminal Strip, Tie-point 1890
* 5 Distribution Strips, Tie-point 500
* 4 Binding Posts
* Blister Card
* Board Size(cm): 17.5*14.5*0.85
* Plate Size(cm): 22.6*17.5*0.12

ABS Plastic material
Completely reusable
Coloured coordinates for easy component placement
Phosphor bronze nickel plated spring clips
Accepts a variety of wrie sizes(AWG: 20-29)