2018 High Quality Aluminum Base LED PCB

モデル番号.
Aluminium PCB-10

Base Material
Aluminum

Board Thickness
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm

Thermal Conductivity
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K

Sample Date
3-5日

輸送パッケージ
Vacuum Packing

仕様
UL, TS16949, IPC 600 CLASS 2

商標
ZAPON

中国

HSコード
85340090

生産能力
50000sqm/Month

説明

製品説明:

Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-あ, CCAF-05等. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, 等.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20″×, 24″); 600mm ×, 1060mm (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
The result of the test:

Technique parameter:

アイテム Test item Technology request Unit Test result
1 Peel Strength 1.8 N/mm 2
After thermal stress (260ordm;C) 1.8 N/mm 1.8
2 Blister test AfterThermal stress (260ºC, 2min ) No delaminating / Ok
3 Flammability(あ) FV-O / FV-O
4 Thermal resistance ≤ 2.0 ordm;C /W 1
5 Surface Resistivity 1 × 10 5 M Ω 5 × 10 7
Constant humidity treatment 1 × 10 5 M Ω 2 × 10 6
(90%,3 5 ordm;C,96h)
6 Volume Resistivity 1 × 10 6 M Ω· m 4 × 10 8
Constant humidity treatment 1 × 10 6 M Ω· m 5 × 10 7
(90%,3 5ordm;C ,96h)
7 Dielectric Breakdown ( DC ) 28.5 Kv/mm 31
8 Dielectric constant (1MHz ) ≤ 4.4 / 4.2
(40 ordm;C,93% , 96h )
9 Dielectric dissipation factor (1MHz ) ≤ 0.03 / 0.02
(40 ordm;C, 93% ,96h )