2018 High Quality Red Soldermask Immersion Gold PCB

Modello numero.
PCB-Multilayer 001

Insulation Materials
Epoxy Resin

Pacchetto di trasporto
Vacuum Packing

Specifica
UL ISO TS16949 IPC2-3 Standard

Marchio
ZAPON

Origine
Cina

Codice HS
85340090

Capacità produttiva
50000sqm/Month

Descrizione

ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.

Manufacturing House:


2018 High Quality Red Soldermask Immersion Gold PCB
2018 High Quality Red Soldermask Immersion Gold PCB

Articolo Capabilities
Number of Layers From 4-layer to 22- Layer
Materiale FR-4, HighTg, Rogers
Halogen Free
PCB Thickness minimo. spessore 0.4mm(16mil)
Massimo. spessore 3.2mm(128mil)
Trattamento superficiale Placcatura in oro
Immersion Gold(Silver)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder Mask Green, Bianco, Nero, Yellow, Rosso, Blue
Other printing Gold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness 1/ 2 oz (18 μ m) – 4 oz (140 μ m)
minimo. Finished Hole Size 0.2mm(8mil)
Hole Size Tolerance (PTH) +/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH) +/-0.05mm (2 mil)
minimo. Line Width and Spacing 0.1mm (4 mil)
minimo. Solder Mask Clearance 0.05mm (2 mil)
minimo. Annular Ring 0.076mm (3mil)
Profile and V-Cut CNC-Routing, Stamping and Beveling, V-CUT, CNC
Special Process Micro-section, Chamfer for Gold Finger
File format Gerber file , CAM350, Protel, PowerPCB
E-TEST Flying Prob , E-test, Fixture
Other Test Impedenza , Slice up
Warp & Twist ≤ 0.7%