Strip Flex LED PCB Manufacturer for Light

Modèle NON.
UC-6582

Processing Technology
Electrolytic Foil

Matériau de base
Pi

Insulation Materials
Epoxy Resin

Marque
Uc

Layer
1

Base Material Type
Polyimide

Épaisseur
0.15-0.2millimètre

Taille
500*8millimètre

Solder Mask Color
White/Black

Surface Treatment
Immersion Gold

Ipc Standards
Ipc Class II

Lead Time
6 Working Days

PCB Testing
E-Testing, Flying Probe Testing

Forfait transport
Vacuum Package

spécification
UL(NOUS&Canada). OIN. RoHs, TS, SGS

Marque déposée
UC

Origine
Shenzhen, Chine

Code SH
8534009000

Capacité de production
20000 Sqm/Month

La description



Ucreate LTD PCB’s aim

Customer Satisfaction is Always Our First Priority!

*Quality Policy

*Top Quality and high efficiency

*Improve continuously

*Achieve customer’s satisfaction

1.Products Application

2. Market Distribution

Strip Flex LED PCB Manufacturer for Light


3.Technical Capabilities

Items Speci. Remark
Max panel size 32x 20.5″(800mm x 520mm)
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer) 5 mil(0.13millimètre) hole ring width
Min thickness(inner layer) 4 mil(0.1millimètre) without copper
Inner copper thickness 1~4 oz
Outer copper thickness 0.5~6 oz
Finished board thickness 0.4-3.2 millimètre
Board thickness tolerance control ±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation
Layer count Capability 1-30 LAYER
alignment between ML ±2mil
Min drilling 0.15 millimètre
Min finished hole 0.1 millimètre
Hole precision ±2 mil(±50 um)
tolerance for Slot ±3 mil(±75 um)
tolerance for PTH ±3 mil(±75um)
tolerance for NPTH ±2mil(±50um)
Max Aspect Ratio for PTH 8:1
Hole wall copper thickness 15-50un
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer 4mil/4mil
Tolerance of Etching +/-10%
Thickness of solder mask on trace 0.4-1.2mil(10-30un)
at trace corner ≥0.2mil(5un)
On base material ≤+1.2mil
Finished thickness
Hardness of solder mask 6H
Alignment of solder mask film ±2mil(+/-50un)
Min width of solder mask bridge 4mil(100un)
Max hole with solder plug 0.5millimètre
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger 280u”(7un)
Max gold thickness for Gold finger 30u”(0.75un)
Nickel thickness in Immersion Gold 120u”/240u”(3um/6um)
Gold thickness in Immersion Gold 2u”/6u”(0.05um/0.15um)
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength ≥61B/in(≥107g/mm)
bow and twist
0.75%


4.Products Equipment

Strip Flex LED PCB Manufacturer for Light
Certificats:
Strip Flex LED PCB Manufacturer for Light
Strip Flex LED PCB Manufacturer for Light
Strip Flex LED PCB Manufacturer for Light
Strip Flex LED PCB Manufacturer for Light