Gold Finger PCB Assembly Circuit Board Mass Production

N º de Modelo.
rigid pcb board

Processing Technology
Immersion Gold

Base Material
Fr4 Tg180

Insulation Materials
Organic Resin

Marca
OEM

Board Thickness
1.8milímetro

Copper
2/2oz

Finish
Immersion Gold 3u

Mini Hole
0.4milímetro

Mini Width/Space
4/4mil

Paquete de transporte
Vacuum

Especificación
185 X 86mm

Marca comercial
NO

Origen
Hecho en china

Código hs
8534009000

Capacidad de producción
4000m2/Mont

Descripción

Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customerssatisfaction.

Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer’s complaint:<1%

Automobile products:
Rate of the first passed products :100%
Rate of customer’s complaint::<0.5%


Fotos detalladas

Parametros del producto
Rigid PCB Production Capacity
SERIAL ARTÍCULO TECHNICAL DATA
1 Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI
2 Layers 232(layers)
3 Max Board Size 450x660mm 18x 26
4 Min Board Thickness 4(layers)0.40mm 16mil
6(layers)0.80mm 32mil
8(layers)1.00mm 40mil
10(layers)1.20mm 48mil
5 Copper Clad(Max.) 20 oz(outer)/4 oz(inner)
6 Min line Width/space 0.075mm 3mil
7 Drill Size Mechanical (min) 0.20mm 8mil
8 Drill Size Laser(min) 0.10mm 4mil
9 PTH Wall Thickness 0.020mm 0.8mil
10 PTH dia tolerance ±0.075mm ±3mil
11 NPTH hole dia tolerance ±0.05mm ±2mil
12 Hole Position Deviation ±0.05mm ±2mil
13 Outline Tolerance ±0.10mm ±4mil
14 S/M Pitch 0.08mm 3mil
15 Resistencia de aislamiento 1E+12Ω(Normal)
16 Test Voltage 50~300V
17 Aspect ratio 8:01
18 Thermal Shock [correo electrónico protegido] ºC
19 Warp and Twist ≤0.7%
20 Current breakdown 10A
21 Electric Strength >1.3KV/mm
22 Peel Strength 1.4N/mm
23 Solder Mask Abrasion ≥6H
24 Flammability 94V-0
25 Impedance Control +/-10%(Differential)
26 Buried Via
27 Blind Via
28 HDI 2+N+2 4mil Via hole
29 Surface Finished ENIG, ImAg, ImSn, OSP, HASL free
30 Materiales FR-4 , Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, black Fr4
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Gold Finger PCB Assembly Circuit Board Mass Production

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Gold Finger PCB Assembly Circuit Board Mass Production