Περιγραφή
Shenzhen LvMeiJinYu Electronic Co.,Ltd
Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, και τα λοιπά., 40% product for oversea market of South America, Europe, Ιαπωνία, Ινδία, Middle East, και τα λοιπά..
Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.
Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.
1. Process capacity
| ΟΧΙ | Είδος | Capabilities |
| 1 | Number of Layers | 2-20 layers |
| 2 | Finished Board Size(Μέγ) | 21.5″×24.5″(546mm×622mm) |
| 3 | Finished Board Thicknes | 0.126″- 0.016″ (0.3mm-3.2mm) |
| 4 | Finished Board Thickness Tolerance |
±10% ±3mil (board thickness≤ 0.8mm) Board Thickness ≤ 0.8mm |
| 5 | Warp age(Ελάχ) | ≤0.7% |
| 6 | Drill Hole Diameter | 0.005″-0.255″ (0.15mm~6.5mm) |
| 7 | Base Copper Thickness of Outer Layer |
1/3 OZ-3OZ (0.012mm -0.102mm) |
| 8 | Base Copper Thickness of Inner Layer |
1/2 OZ-3 OZ (0.017mm -0.105mm) |
| 9 | Type of Base Material | FR-4 (130ºCTg-180ºCTg),CEM3,etc |
| 10 | Aspect Ratio of Plated Hole(Μέγ) | 10:01:00 |
| 11 | Hole Diameter Tolerance(PTH) | ±3mil ( ±0.075mm) |
| 12 | Hole Diameter Tolerance(NPTH) | ±1mil ( ±0.025mm) |
| 13 | Copper Thickness of PTH Wall | ≥0.8mil (≥0.020mm) |
| 14 | Design Line Width/Space of Inner Layer(Ελάχ) |
H/HOZ 3.0mil/3.0mil(0.075mm /0.075mm) 1/1OZ 4mil/4mil(0.1016mm/ 0.1016mm) 2/2OZ 5mil/5mil(0.127mm/0.127mm) |
| 15 | Design Line Width/Space of Outer Layer(Ελάχ |
T/TOZ 3.0mil/3.0mil (0.075mm/ 0.075mm) H/HOZ 3.5mil/3.5mil(0.089mm/0.089mm) 1/1OZ 4.5mil/4.5mil (0.114mm/0.114mm ) 2/2OZ 6mil/6mil (0.152mm/0.152mm ) 3/3OZ 7mil/7mil (0.152mm/0.152mm) |
| 16 | Solder Mask Bridge(Ελάχ) | 2. 5mil (0.064mm) |
| 17 | Dimension Tolerance (Hole to Edge)(Ελάχ) |
±4mil ( ±0.101mm) |
| 18 | Thermal Shock | 288 ºC 10secs(3φορές) |
| 19 | Ionic Contamination | <1.56ug/cm2(NaCl) |
| 20 | Peel Strength | ≥1.4N/mm |
| 21 | Natural Impedance Control | ±10% |
| 22 | Solder Mask Strength | >6H |
| 23 | Surface Treatmet | Nickel /Gold Plating, HASL(Lead-free), OSP, ENIG, Immersion Silver, Carbon Oil, Peelable Mask, και τα λοιπά. |
2. Χρόνος ανοχής
3. Major Equipment
3. Main Customers
Any question, Pls contact us,Thank you!