Enig 10L Printed Circuit Board Micro Base Station PCB Board

Περιγραφή

ShenzhenShi LvMeiJinYu Electronics Co.,Ltd

Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, και τα λοιπά., 40% product for oversea market of South America, Europe, Ιαπωνία, Ινδία, Middle East, και τα λοιπά..

Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.

Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.

Different Product

1. Process capacity

Process Capability And Checking Parameters(Hard Board)
ΟΧΙ	ITEM	Technical Capabilities
1	Layers	2-58μεγάλο ,68L for samples
2	Max.Board Size	1200*610mm
		48″*24″
3	Finished Board Thickness	0.2mm–10.0mm,17.5mm for samples
		0.008″–0.4″
4	Finished Copper Thickness	17um-420um
		0.5OZ–12OZ
5	Min.Trace Width/Space	0.075mm/0.065mm
		0.003″/0.0026″
6	Min.Hole Size	0.15mm
		0.006″
7	Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002″
8	Hole Dim.Tolerance(NPTH)	±0.05mm
		±0.002″
9	Drill Location Tolerance	±0.05mm
		±0.002″
10	V-Cut Degrees	20-90 ºC
		20DEG-90DEG
11	Min.V-Cut PCB Thickness	0.4mm
		0.016″
12	N/C Routing Tolerance	±0.1mm
		±0.004″
13	Min.Blind/Buried Via	0.15mm
		0.06″
14	Plug Hole Size	0.2mm–0.6mm
		0.008″–0.024″
15	Min.BGA PAD	0.2mm
		0.008″
16	Materials	FR4,Aluminium,High Tg,Halogen-free,Rogers,ShengYi,KB

17	Surface Finish	LF-HAL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HAL+G/F

18	Warp & Twist	≤0.75%

19	Electrical Testing	50–300V

20	Solderability Testing	245±5ºC,3sec Wetting area least95%

21	Thermal Cycling Testing	288±5ºC,10sec,3cycles

22	Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23	Soldmask Adhesion Testing	260ºC+/-5, 10S,3φορές

Process Capability – Technical Parameters(FPC)
Content	Common	Special	Surface treatment	Thickness
Minimum line width	0.07mm	0.05mm	Electroplated nickel gold	Ni:3-9um;Au:0.03-0.1um
Minimum line spacing	0.07mm	0.05mm
Minimum Drilling aperture	Φ 0.15mm	Φ 0.1mm
Aperture Tolerance	±0.1mm	±0.05mm	Chemical immersion gold	Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (double panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)	610*1650mm		Electroplated hard gold	Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance	±10%		Electroplated pure tin	Sn:3-7um
Maximum production layer	12μεγάλο
Thickness To Diameter Ratio	2:1(Minimum aperture 0.1mm)
	5:1(Minimum aperture 0.2mm)		Anti-oxidation
	8:1(Minimum aperture 0.3mm)
Monthly production capacity/m²	16000 m²

Υλικό
Substrate Material	PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium	Copper foil(1/3oz,1/2oz,1oz,2oz)
	Constantan
	Silver Paste
	Copper Ink
Adhesive	Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film	PI(0.5mil,1mil,2mil)(Yellow, Λευκό, Black)
	PET(1mil,2mil)
	Solder mask (green, κίτρινος, μαύρος…)
Glue	3M467,3M468,3M9077,TESA8853…
Reinforcement Type	PI,FR4,PET,Steel,Aluminum…

2. Χρόνος ανοχής

3. Stack-Up

4.Product Type

If you have PCB project pls send your Gerber files and PCB specification,we will reply to you ASAP. Thank you!