2390 Tie Points Interlocking Solderless Breadboard

Αριθμός Μοντέλου.
ZY-206

Housing Material
ABS

Dielectric
SIC

Πακέτο μεταφοράς
Blister Card

Εμπορικό σήμα
OEM

Προέλευση
Κίνα

Κωδικός HS
8534009000

Παραγωγική ικανότητα
15000 Piece/Pieces/Day

Περιγραφή


2390 Tie Points Interlocking Solderless Breadboard
2390 Points Solderless Breadboard
* 3 Terminal Strip, Tie-point 1890
* 5 Distribution Strips, Tie-point 500
* 4 Binding Posts
* Blister Card
* Board Size(εκ): 17.5*14.5*0.85
* Plate Size(εκ): 22.6*17.5*0.12

ABS Plastic material
Completely reusable
Coloured coordinates for easy component placement
Phosphor bronze nickel plated spring clips
Accepts a variety of wrie sizes(AWG: 20-29)