Περιγραφή
περιγραφή προϊόντος:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-ΕΝΑ, CCAF-05και τα λοιπά. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, και τα λοιπά.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20″×, 24″); 600mm ×, 1060mm (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
The result of the test:
It’s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-ΕΝΑ, CCAF-05και τα λοιπά. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, και τα λοιπά.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20″×, 24″); 600mm ×, 1060mm (24″×, 42″)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
The result of the test:
Technique parameter:
| Είδος | Test item | Technology request | Unit | Test result | ||
| 1 | Peel Strength | ΕΝΑ | ≥ 1.8 | N/mm | 2 | |
| After thermal stress (260ordm;ντο) | ≥ 1.8 | N/mm | 1.8 | |||
| 2 | Blister test AfterThermal stress (260ºντο, 2min ) | No delaminating | / | Ok | ||
| 3 | Flammability(ΕΝΑ) | FV-O | / | FV-O | ||
| 4 | Thermal resistance | ≤ 2.0 | ordm;C /W | 1 | ||
| 5 | Surface Resistivity | ΕΝΑ | ≥ 1 × 10 5 | M Ω | 5 × 10 7 | |
| Constant humidity treatment | ≥ 1 × 10 5 | M Ω | 2 × 10 6 | |||
| (90%,3 5 ordm;ντο,96h) | ||||||
| 6 | Volume Resistivity | ΕΝΑ | ≥ 1 × 10 6 | M Ω· m | 4 × 10 8 | |
| Constant humidity treatment | ≥ 1 × 10 6 | M Ω· m | 5 × 10 7 | |||
| (90%,3 5ordm;ντο ,96h) | ||||||
| 7 | Dielectric Breakdown ( DC ) | ≥ 28.5 | Kv/mm | 31 | ||
| 8 | Dielectric constant (1MHz ) | ≤ 4.4 | / | 4.2 | ||
| (40 ordm;ντο,93% , 96h ) | ||||||
| 9 | Dielectric dissipation factor (1MHz ) | ≤ 0.03 | / | 0.02 | ||
| (40 ordm;ντο, 93% ,96h ) | ||||||