2018 High Quality Red Soldermask Immersion Gold PCB

Modell Nr.
PCB-Multilayer 001

Insulation Materials
Epoxy Resin

Transportpaket
Vacuum Packing

Spezifikation
UL ISO TS16949 IPC2-3 Standard

Warenzeichen
ZAPON

Herkunft
China

HS-Code
85340090

Produktionskapazität
50000sqm/Month

Beschreibung

ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.

Manufacturing House:


2018 High Quality Red Soldermask Immersion Gold PCB
2018 High Quality Red Soldermask Immersion Gold PCB

Artikel Capabilities
Number of Layers From 4-layer to 22- Layer
Material FR-4, HighTg, Rogers
Halogen Free
PCB Thickness Min. thickness 0.4mm(16mil)
max. thickness 3.2mm(128mil)
Surface Treatment Gold Plating
Immersion Gold(Silber)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder Mask Green, Weiß, Schwarz, Yellow, Rot, Blau
Other printing Gold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness 1/ 2 oz (18 μ m) – 4 oz (140 μ m)
Min. Finished Hole Size 0.2mm(8mil)
Hole Size Tolerance (PTH) +/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH) +/-0.05mm (2 mil)
Min. Line Width and Spacing 0.1mm (4 mil)
Min. Solder Mask Clearance 0.05mm (2 mil)
Min. Annular Ring 0.076mm (3mil)
Profile and V-Cut CNC-Routing, Stamping and Beveling, V-CUT, CNC
Special Process Micro-section, Chamfer for Gold Finger
File format Gerber file , CAM350, Protel, PowerPCB
E-TEST Flying Prob , E-test, Fixture
Other Test Impedance , Slice up
Warp & Twist ≤ 0.7%