High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB

Processing Technology
Electrolytic Foil

Base Material
Copper

Insulation Materials
Epoxy Resin

Mærke
Kb/Shengyi/Panasonic/Sumitomo/South Asia

Transportpakke
Karton

Oprindelse
Kina

Produktionskapacitet
3.3 Million Square Feet

Beskrivelse

We are a PCB manufacturer with strong technical force, advanced production technology, testing equipment. Our factory covers an area of eighty thousand square meters with a monthly production capacity of three hundred and thirty thousand square meters. All the laminated board materials used in PCB production of our company are produced by the group itself. From the most upstream basic chemical raw materials to the middle of the processing glass fiber/glass fiber cloth and the final cost laminated board to achieve 100% homemade.Because of our vertical supply chain and raw material advantages, we can ensure a stable supply of substrate and fast PCB deliver. The lead time of multi-layer sample is 5-7 dage, and the lead time of mass production is 10-21 dage.

Lead times

Capabilities
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB
Technology Map
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB

Our factory has advanced automation equipment and highend density detection instrument, such as automatic DVCP production line, fully automatic solder Mask and Silkscreen Printing machine, automatic AOI/AVI/E-test and so on.In addition,we have a strong technical support, so we can produced the board with the resin plug hole, copper filled and silver filled, HDI and other technical complex processes. These advanced technologies and equipments provide a strong guarantee for our great production capacity and high quality product

Major Equipment

High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB
Fully Dedicated Immersion Lines
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB
One Continuous Line : Solder Mask to Legend

High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB

New PTH Line
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB
Besides,our factory have enough testing equipment, such as AVI appearance testing equipment, CTI tester, weldability tester, ionic contamination tester and other testing equipment, which can avoid defective products flow into customer side.

Inspections Equipment
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCBHigh Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB
At the same time, our company has passed the ISO45001 a number of international certification, ISO14001, ISO13458, ISO9001, IATF16949, VDE, CQC and so on more than 10 items.
High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB In addition,We have physics lab and professional technical team that we can resolve technical problems by ourselves.At the same time, we have high requirements for environmental protection.our treatment of waste gas fully meets the national class III emission standard.Welcome to contact us for inquiry anytime and Looking forward to cooperating with you.